Quick 850A SMD Rework Station for SMD BGA Soldering Repair Station

Product Details:

• Fast 850A SMD Rework Station.
  
• Airflow: 24L/min(max)
• Outer Dimension: 185x125x245mm
• Power: 320W
• Temperature: 150°C ~ 500°C
• 
  

Use:

1. Suitable for desoldering most surface mount parts of circuit boards, such as SOIC, CHIP, QFP, PLCC, BGA, etc.

2. Suitable for shrink tube shrinkage.

3. Suitable for removing small debris.

4, suitable for electronic components to drive the tide.

Functional:

1. The main components, such as heating wire, can be connected to the silicone frame and other internationally famous products, nozzles, and brands.

2. Anti-static design to prevent damage to the PCB board software due to static electricity or leakage.

3, no need to contact the solder joint welding method, which can prevent parts displacement and thermal shock.

4, can greatly adjust the size of the airflow and temperature, can be soldered QFP, SOP type IC or other types of IC. (Soldering and tin removal can be done according to different requirements.)

5. Power off after the completion of welding work, it may delay the air supply, delay the heating body, and the service life of the handle.

6, withstand strong pulse current impact. Don't burn the machine.

7. Wide application voltage range: can be used in the range of 100VAC ~ 250VAC

Application:

1. Suitable for desoldering various types of components such as SOIC, CHIP, QFP, PLCC, BGA, etc.

2. Can be used for heat shrinking, drying, paint and sticker removal, preheating, scratching, glue connection, etc.